AMB-21

NASA-Glenn Developed Polyimide

AMB-21 is capable of withstanding long term exposure to 525°F (274°C). AMB-21 is easy to process and is available as a solution for prepreg or a powder for molding compounds.

Properties

• Glass Transition Temperature:
  500 - 525ºF (260 - 274 ºC)
  
  
• Thermal Oxidative Stability:
  3 - 4% weight loss at 500°F (260°C), 5000 hours
  7 - 8% weight loss at 550°F (288°C), 5000 hours
  
  
• Resin Solids Content:
  Can be formulated up to 60% wt. solids
  
  
• Solution Density:
  1.0 - 1.1 gm/cc
  
  
• Solution Viscosity @ 55% solids:
  50 - 200 cps at RT, Spindle #2, 10 RPM

Processing

• Autoclave Molded
  
  
• Compression Molded
  
  
• Solvent Assisted Resin Transfer Molded (saRTM)

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